Introduction to Model 177230-00-01-05
The 177230-00-01-05 is a high-density, high-speed electrical or optical backplane connector system. It is designed for use in demanding mission-critical systems where reliable signal integrity and high data throughput are paramount. This connector series typically features a robust metal shell, precision contacts, and a modular design that supports a large number of signal, power, and coaxial contacts in a compact form factor. It is commonly used as a foundational component in advanced radar, aerospace, defense, and high-performance computing (HPC) systems.
Key Parameters
The following table summarizes the key technical and physical specifications for the 177230-00-01-05.
| Parameter Category | Specification |
|---|---|
| Product Type | High-Density Multi-Pin Rectangular Connector (Backplane Style) |
| Dimensions (L x W x H) | Varies by configuration; a typical shell size is approximately 150 mm x 45 mm x 30 mm (Excluding mounting hardware) |
| Weight | Approximately 200 - 250 grams (Highly dependent on contact population) |
| Shell Material | Aluminum Allody or similar, with finish (e.g., Cadmium, IVD Aluminum) for corrosion resistance. |
| Contact Types | Mix of Signal, Power, and Coaxial (typically 0.076" or 0.100" grid) |
| Number of Positions | Configurable; can support over 200+ contacts. |
| Current Rating | Signal Contacts: ~3-5 A per contact. Power Contacts: Higher capacity (e.g., 13A+). |
| Voltage Rating | Up to 500 VAC/VDC |
| Operating Temperature | -55°C to +125°C (or as specified by the environment) |
| Coupling Mechanism | Jackscrews or Bolts for high-vibration environments. |
| Connector Gender | Typically the "Plug" or "Male" half of the connector system. |
Note: These parameters are representative of this class of connector. The exact values, especially dimensions and weight, can vary significantly based on the specific contact configuration and accessories. The official manufacturer's datasheet must be consulted for the precise and guaranteed specifications.
Application Scenarios
The 177230-00-01-05 is engineered for the most demanding applications where failure is not an option.
Aerospace and Defense:
Radar Systems: Used in airborne and ground-based radar arrays for interconnecting signal processing and power distribution units.
Avionics Bay Interconnects: Provides reliable connections between line-replaceable units (LRUs) in aircraft avionics suites.
Military Vehicles: Connects critical electronic systems in tanks, command posts, and communication vehicles.
High-Performance Computing (HPC) and Servers:
Used in supercomputers and large server racks for high-speed backplane or mid-plane interconnections that require massive data bandwidth.
Telecommunications Infrastructure:
Found in high-capacity core network routers and switches that demand robust, high-density inter-board connections.
Test and Measurement Equipment:
Used in sophisticated Automatic Test Equipment (ATE) for interfacing with complex units under test (UUTs), where a large number of signals need to be routed reliably.
Industrial Control Systems:
Applied in large-scale industrial automation and process control systems where ruggedness and high pin count are required for controller backplanes.
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